3.96 mm · Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B
WF3964 Series Wire-to-Board Connector
WF3964 Series wire-to-board connector, 3.96 mm pitch — Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B; Wire to Board. Rated 7.0 A, -40°C to +105°C.
Distributed product
Designed and manufactured by WCON — Yueyang is a distributor, not the designer or manufacturer.
Product Model List
22 catalogued part numbers
| Ordering code | Component | Variant |
|---|---|---|
| WF3964-24HITXXBT01 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-24HITXXBT02 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-22HITXXBT01 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-22HITXXBT02 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-20HITXXBT01 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-20HITXXBT02 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-18HITXXBT01 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-18HITXXBT02 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-XXHIEXXT01 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-XXHIEXXT02 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-24HIEXXBT01 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-24HIEXXBT02 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-22HIEXXBT01 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-22HIEXXBT02 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-20HIEXXBT01 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-20HIEXXBT02 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-18HIEXXBT01 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-18HIEXXBT02 | Wafer | Wire to Board, Receptacle, WAFER: WF 3964- 18 HI E X C XX B |
| WF3964-AWSXXXXB01 | Wafer | Wire to Board |
| WF3964-BWSXXXXB01 | Wafer | Wire to Board |
| WF3964-AWRXXXXB01 | Wafer | Wire to Board |
| WF3964-BWRXXXXB01 | Wafer | Wire to Board |
For the complete selection, please contact engineering — more variants, packages and grades are available than listed here.
Contact engineeringDistributed by Yueyang — designed and manufactured by WCON. Specifications, ordering codes and part-numbering rules are transcribed from the connector catalogue; outline drawings and PCB layouts are not reproduced here. For the complete selection, drawings and samples, please contact engineering.
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