1.27 mm pitch wafer, housing & crimp terminal
WF1271 Series Wire-to-Board
A 1.27 mm pitch wire-to-board system — S/T DIP, R/A DIP and S/T SMT wafers, a mating housing, and a crimp terminal for AWG24–32 wire — 2 to 50 positions per row.
Distributed product
Designed and manufactured by WCON — Yueyang is a distributor, not the designer or manufacturer.
Product Features
S/T DIP, R/A DIP and S/T SMT wafer mounting
Matching housing with ear/latch options (types 0–3)
Crimp terminal for AWG24–32 wire
Contact resistance ≤30 mΩ, phosphor-bronze contacts, PA9T + 30% GF insulator
Application Areas
Part Numbering Rule
WF1271 – 2 – WZ – H – XX – S0 – B – T – 0
WF1271Series
2Variant
WS/WR/WMWafer mounting: S/T DIP, R/A DIP, S/T SMT
H/XXHousing / positions
S0Contact plating: gold flash/tin
BColour
TPackaging: tube/tape&reel
0–3Ear/latch option
For the complete selection, please contact engineering — more variants, packages and grades are available than listed here.
Contact engineeringDistributed by Yueyang — designed and manufactured by WCON. Line-card summary from the client's connector catalogue — for the complete selection, please contact engineering.
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