2.54 mm pitch wafer, housing & crimp terminal
WF2547 Series Wire-to-Board
A 2.54 mm pitch wire-to-board system — S/T DIP and R/A DIP wafers, a mating housing, and a crimp terminal for AWG22–28 wire — 2 to 20 positions per row.
Distributed product
Designed and manufactured by WCON — Yueyang is a distributor, not the designer or manufacturer.
Product Features
S/T DIP and R/A DIP wafer mounting
Matching housing and brass/phosphor-bronze crimp terminal
Contact resistance ≤20 mΩ, insulation resistance ≥1000 MΩ
Withstand voltage 1000 V AC / minute
Application Areas
For the complete selection, please contact engineering — more variants, packages and grades are available than listed here.
Contact engineeringDistributed by Yueyang — designed and manufactured by WCON. Line-card summary from the client's connector catalogue — for the complete selection, please contact engineering.
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