3.00 mm pitch wire-to-board
YS3001
3.00mm间距/线到板连接器 · Manual p. 75
A high-performance, compact 3.00 mm pitch wire-to-board connector that carries power without compromising space or reliability, with reflow-capable LCP construction.
Semi-custom part numbers can be assigned to your requirement — contact engineering for tightened parameters or extended temperature grades.
Product Features
Anti-mispug structure
Flexible and versatile installation methods
Supports reflow soldering process (LCP material)
With lock design, the connection is stable
