3.00 mm pitch wire-to-board
YS3001
Manual p. 75
A high-performance, compact 3.00 mm pitch wire-to-board connector that carries power without compromising space or reliability, with reflow-capable LCP construction.
Semi-custom part numbers can be assigned to your requirement — contact engineering for tightened parameters or extended temperature grades.
Product Features
Anti-mispug structure
Flexible and versatile installation methods
Supports reflow soldering process (LCP material)
With lock design, the connection is stable
Application Areas
For the complete selection, please contact engineering — more variants, packages and grades are available than listed here.
Contact engineering